During the semiconductor manufacturing process, multiple steps release fumes, hazardous gases, and odors.
1. Lithography
Contaminants: Organic solvents (such as PGMEA and ethyl acetate) and VOCs (volatile organic compounds) released during photoresist coating, development, and baking.
2. Etching
Dry Etching
Contaminants: Toxic gases such as fluorides (CF₄, SF₆), chlorides (Cl₂, BCl₃), and plasma byproducts.
Wet Etching
Contaminants: Acidic/alkaline mists (such as HNO₃, HF, and NH₄OH).
3. Thin Film Deposition (CVD/PVD)
Chemical Vapor Deposition (CVD)
Contaminants: Highly toxic gases such as silane (SiH₄), ammonia (NH₃), and phosphine (PH₃), as well as reaction byproduct particles.
Physical Vapor Deposition (PVD)
Contaminants: Nanoparticles (such as Al and Ti) formed by condensation of metal vapor.
4. Ion Implantation
Contaminants: Particles generated by dopant gases (such as BF₃ and AsH₃) and high-energy ion bombardment.
5. Chemical Mechanical Polishing (CMP)
Contaminants: Ammonia (NH₃), organic amines, and aerosols emitted from polishing slurry.
6. Wafer Cleaning
Contaminants: Acid mist, ammonia, and ozone (O₃) generated by RCA cleaning (H₂O₂, NH₄OH, and HCl).
7. Packaging & Testing
Contaminants: Benzene-based organic compounds emitted from epoxy resins, welding fumes, and cutting dust.
